The purpose of this book is stated by the author as being the instruction of new recruits to the IC industry. In this objective, the book is an outstanding success. The eight chapters cover the following: Materials, Wafer Production and Surface Preparation, Resist Coating, Imaging, Multilayer Devices, Developers, Etching, and, finally, Doping and Metallization.

This is a state-of-the-art, technological book and is not concerned with computing or with computer microchips as such. However, it is very readable and will appeal to any computer scientist who is curious about the way in which microdevices are actually made and who wishes to know what improvements can be expected in the next five years.

Two “bugs” were noted. First, the description of the method of cutting crystals given on p. 29 is incomprehensible and bears no resemblance to Figure 2.1 to which it refers. Second, p. 149 contains a reference to a nonexistent Figure 4.33 (e).